I see you delidded, is the IHS soldered on or does it use a thermal compound between the die and IHS?

Hi,

There is a thermal paste between the DIE and the IHS.

Similar as the Athlon 750k-760k and 860k on FM2+

But be carefull, because it is really really hard to remove the IHS...

In normal condition at same voltage if i use a graphic card and disable the IGP, i can reach 3.1ghz fully stable 8 hour with occt large data + realbench.

You'll need also a good topflow cooling for helping the VRM