There is a thermal paste between the DIE and the IHS.
Similar as the Athlon 750k-760k and 860k on FM2+
But be carefull, because it is really really hard to remove the IHS...
In normal condition at same voltage if i use a graphic card and disable the IGP, i can reach 3.1ghz fully stable 8 hour with occt large data + realbench.
You'll need also a good topflow cooling for helping the VRM
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I see you delidded, is the IHS soldered on or does it use a thermal compound between the die and IHS?
Hi,
There is a thermal paste between the DIE and the IHS.
Similar as the Athlon 750k-760k and 860k on FM2+
But be carefull, because it is really really hard to remove the IHS...
In normal condition at same voltage if i use a graphic card and disable the IGP, i can reach 3.1ghz fully stable 8 hour with occt large data + realbench.
You'll need also a good topflow cooling for helping the VRM
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